Connection structure of printed wiring board



PROBLEM TO BE SOLVED: To provide the connection structure of a printed wiring board in which electrical conductivity between terminals (between printed wiring boards) is excellent with a thinner and compact connection part at a reduced cost. SOLUTION: When connecting a first printed wiring board 10 to a second printed wiring board 20, the surface of a terminal 1 of the first printed wiring board is bonded to the surface of a terminal 2 of the second printed wiring board, so that the terminals are combined to each other by plated layers 3 formed on the side of the terminals. COPYRIGHT: (C)2006,JPO&NCIPI
【課題】 端子部間(プリント配線基板間)の電気的導通性に優れ、かつ接続部の薄型化、コンパクト化を図るとともに、コストの低減化を図ったプリント配線基板の接続構造を提供する。 【解決手段】 第1プリント配線基板10と第2プリント配線基板20とを接続するにあたって、第1プリント配線基板の端子部1の表面と、第2プリント配線基板の端子部2の表面とを接着し、当該端子部同士の側面に形成しためっき層3によって前記端子部同士を結合させたプリント配線基板の接続構造。 【選択図】 図1




Download Full PDF Version (Non-Commercial Use)

Patent Citations (0)

    Publication numberPublication dateAssigneeTitle

NO-Patent Citations (0)


Cited By (1)

    Publication numberPublication dateAssigneeTitle
    JP-2009226885-AOctober 08, 2009Fujifilm Corp, 富士フイルム株式会社Connection structure, connection method, liquid ejection head, and image forming apparatus