発熱部品の放熱構造と、この放熱構造における放熱部材の製造方法

Heat-radiating structure of heat-generating component, and manufacturing method of heat-radiating member present therein

Abstract

PROBLEM TO BE SOLVED: To efficiently guide heat generated from a plurality of heat-generating components, to a place giving no thermal effects to their peripheries as to be able to make the heats radiated to the external by a single heat-radiating member. SOLUTION: The forming method of a heat-radiating structure has a step for providing in a printed wiring board 10 through holes 11, 12, 13 corresponding to heat-generating elements 14, 15, 16; a step of providing in a heat-radiating member 20 for heat radiating protrusive portions 25, 26, 27 corresponding to the through holes 11, 12, 13; and a step of so inserting these heat radiating protrusive portions 25, 26, 27 into the through holes 11, 12, 13 as to interpose thermal conductive materials 30, respectively in between the heat radiating protrusive portions 25, 26, 27 and the heat-generating elements 14, 15, 16, and as to guide the heat generated by the heat-generating elements 14, 15, 16 to the heat-radiating member 20 via the thermal conductive materials 30 and radiate the heat to the external. COPYRIGHT: (C)2006,JPO&NCIPI
【課題】 単一の放熱部材で、複数の放熱部品から発熱された熱を、周囲への熱影響がない個所に効率よく誘導し放熱させることができるようにする。 【解決手段】 印刷配線基板10に、発熱素子14、15、16に対応する貫通穴11、12、13を設け、放熱部材20に貫通穴11、12、13に対応する放熱用凸部25、26、27を設け、これらの放熱用凸部25、26、27を貫通穴11、12、13に挿入して放熱用凸部25、26、27と発熱素子14、15、16との間に熱伝導材30を介在させて、発熱素子14、15、16が発する熱を、熱伝導材30を介して放熱部材20に誘導し放熱させるようにした。 【選択図】 図3

Claims

Description

Topics

Download Full PDF Version (Non-Commercial Use)

Patent Citations (0)

    Publication numberPublication dateAssigneeTitle

NO-Patent Citations (0)

    Title

Cited By (6)

    Publication numberPublication dateAssigneeTitle
    CN-104470209-AMarch 25, 2015乾坤科技股份有限公司金属芯印刷电路板及电子封装结构
    JP-2006156610-AJune 15, 2006Nidec Copal Electronics Corp, 日本電産コパル電子株式会社回路基板
    JP-2007318139-ADecember 06, 2007Valeo Vision, ヴァレオ ビジョンValeo VisionHeat dissipation element and diode lighting or signaling device having the same
    JP-2009289934-ADecember 10, 2009Apic Yamada Corp, アピックヤマダ株式会社半導体実装基板及びその製造方法
    JP-2010141279-AJune 24, 2010Calsonic Kansei Corp, カルソニックカンセイ株式会社Structure and method for radiating heat of element
    US-8575746-B2November 05, 2013Samsung Electronics Co., Ltd.Chip on flexible printed circuit type semiconductor package